IEEE FLEPS 2020

IEEE FLEPS 2020 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

IEEE International Conference on Flexible and Printable Sensors and Systems

June 28 - July 1, 2020 | Hilton Deansgate Manchester, UK

IEEE FLEPS 2020 Keynote Speakers Announced!

The IEEE FLEPS 2020 Organizing Committee is excited to announce the Keynote Speakers for this years upcoming edition. Click below to learn more.
Focused Session Proposal Submission Deadline

Mon, Jan 27th, 2020

Tutorial Proposal Submission

Mon, Jan 27th, 2020

Paper Submission Deadline

Sun, Mar 1st, 2020

Notification of Paper Acceptance

Mon, Apr 20th, 2020

Deadline:
IEEE FLEPS 2020 Call for Papers
Download

Call for Papers

The 2nd edition of the IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2020) will be held in Manchester, England, United Kingdom. Known throughout the world as the birthplace of the industrial revolution, Manchester has a proud history in science, politics, music, arts and sport. And today the city combines this heritage with a progressive vision to be a city that delivers surprise and delight in equal measures. 

IEEE FLEPS 2020 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

Topics Of Interest

  • Organic Electronics
  • Emerging Materials for Flexible and Printable Systems
  • Manufacturing Techniques (including Printing)
  • High-throughput Printable Electronics
  • Organic/Inorganic/Hybrid Flexible Sensors and Electronics
  • Stretchable/Shrinkable Sensors and Electronics
  • Soft/Smart Wearable and Implantable Sensing Systems
  • Printed Large-Area Sensors and Systems
  • Disposable/Reusable Sensors and
    Electronics
  • Flexible or Printed Active and Passive Components (e.g. actuators, printed energy storage, generation devices, smart labels, RFID etc.)
  • Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
  • Simulation and Modelling
  • Flexible/Printable Electronics in context with Circular Economy

IEEE FLEPS 2020 Keynote Speakers

John Rogers

Founder, Executive Director Northwestern University, USA

Joseph Wang

Distinguished Professor and SAIC Endowed Chair In the Department of Nanoengineering University of California, San Diego (UCSD)