IEEE FLEPS 2020

IEEE FLEPS 2020 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

FLEPS 2020 Best Student Paper Awards

1st Place
“Si Nanoribbons Based High Performance Printed FETs Using Room-Temperature Deposited Dielectric”
Ayoub Zumeit, Dhayalan Shakthivel, Ravinder Dahiya

2nd Place
“Method for Inkjet-Printing PEDOT:PSS Polymer Electrodes on Piezoelectric PVDF-TrFE Fibers”
Andrew Closson, Haley Richards, Lin Dong, Zhe Xu, John Zhang

3rd Place
“3D Printed Robotic Hand with Embedded Touch Sensors”
Markellos Ntagios, Pablo Escobedo, Ravinder Dahiya

IEEE FLEPS 2020 Keynote Speakers- Live Sessions!

The IEEE FLEPS 2020 Organizing Committee would like to invite you to join us from August 17-19 at 13:30 BST. Please see the zoom links below:

August 17, 2020: Plenary Talk #1 John Rogers and Young Professionals Panel August 18, 2020: Plenary Talk #2 Joseph Wang August 19, 2020: Plenary Talk #3 Richard Price

Final Manuscript Submission Deadline

July 1, 2020

Advanced Registration Deadline

July 8, 2020

Presentation Upload Deadline

July 17, 2020

Deadline: Apr 17, 2020

fleps2020-cfp_web_04.pdf

Download

Call for Papers

The 2^nd edition of the IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2020) will be held in Manchester, England, United Kingdom. Known throughout the world as the birthplace of the industrial revolution, Manchester has a proud history in science, politics, music, arts and sport. And today the city combines this heritage with a progressive vision to be a city that delivers surprise and delight in equal measures.

Topics Of Interest

Organic Electronics
Emerging Materials for Flexible and Printable Systems
Manufacturing Techniques (including Printing)
High-throughput Printable Electronics
Organic/Inorganic/Hybrid Flexible Sensors and Electronics
Stretchable/Shrinkable Sensors and Electronics
Soft/Smart Wearable and Implantable Sensing Systems
Printed Large-Area Sensors and Systems
Disposable/Reusable Sensors and
Electronics
Flexible or Printed Active and Passive Components (e.g. actuators, printed energy storage, generation devices, smart labels, RFID etc.)
Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
Simulation and Modelling
Flexible/Printable Electronics in context with Circular Economy

IEEE FLEPS 2020 Keynote Speakers

John Rogers

Louis Simpson and Kimberly Querrey Professor of Materials Science and Engineering, Biomedical Engineering and Neurological Surgery

Northwestern University, USA

John Rogers

Biography

Professor John A. Rogers obtained BA and BS degrees in chemistry and in physics from the University of Texas, Austin, in 1989. From MIT, he received SM degrees in physics and in chemistry in 1992 and the PhD degree in physical chemistry in 1995. From 1995 to 1997, Rogers was a Junior Fellow in the Harvard University Society of Fellows. He joined Bell Laboratories as a Member of Technical Staff in the Condensed Matter Physics Research Department in 1997, and served as Director of this department from the end of 2000 to the end of 2002. From 2003-2016, he was on the faculty at University of Illinois at Urbana/Champaign, where he held a Swanlund Chair, the highest chaired position at the university, with a primary appointment in the Department of Materials Science and Engineering, and joint appointments in the Departments of Chemistry, Bioengineering, Mechanical Science and Engineering, and Electrical and Computer Engineering. He served as the Director of a Nanoscale Science and Engineering Center on nanomanufacturing, funded by the National Science Foundation from 2009-2012 and as Director of the Seitz Materials Research Laboratory from 2012 to 2016. In September of 2016, he joined Northwestern University as the Louis Simpson and Kimberly Querrey Professor of Materials Science and Engineering, Biomedical Engineering, Mechanical Engineering, Electrical Engineering and Computer Science, Chemistry and Neurological Surgery, where he is also the founding Director of the Center on Bio-Integrated Electronics. He has published more than 550 papers, and is an inventor on over 100 patents and patent applications, more than 70 of which are licensed or in active use by large companies and startups that he has co-founded. His research has been recognized with many awards including the Smithsonian Award for American Ingenuity in the Physical Sciences, the Lemelson-MIT Prize and a MacArthur Fellowship. He is a is a member of the National Academy of Engineering, the National Academy of Sciences and the American Academy of Arts and Sciences.

Affiliation(s)

Louis Simpson and Kimberly Querrey Professor of Materials Science and Engineering, Biomedical Engineering and Neurological Surgery

Northwestern University, USA

Joseph Wang

Distinguished Professor and SAIC Endowed Chair In the Department of Nanoengineering

University of California, San Diego (UCSD)

Dr. Richard Price

Chief Technology Officer

PragmatIC

Website

IEEE FLEPS 2020

FLEPS 2020 Best Student Paper Awards

IEEE FLEPS 2020 Keynote Speakers- Live Sessions!

Final Manuscript Submission Deadline

Advanced Registration Deadline

Presentation Upload Deadline

Deadline: Apr 17, 2020

fleps2020-cfp_web_04.pdf

Call for Papers

Topics Of Interest

IEEE FLEPS 2020 Keynote Speakers

John Rogers

Joseph Wang

Dr. Richard Price

Sponsors